於根管治療中，根尖區出現大的骨頭缺損，如何幫助傷口之癒合為一具挑戰之工作。臨床上鈣矽類化合物常用於根尖切除手術之根尖充填、牙髓穿孔之修補或作為根尖再生之材料。本研究室研發出之鈣矽類材料對於其物性、化性與細胞相容性都有良好的表現，對於骨細胞更具有骨傳導效應。因此本研究計畫動機，乃期望進一步將研發之材料結合不同物質後，發展成為骨水泥類之材料，除對於根管用途上，也能作為骨修復之材料。三鈣磷酸鹽的特點為：一、具可塑性，可修補複雜形?的骨折、骨缺陷。 二、硬化後含有很大比?的孔隙?，晶體結構與自然骨結構相似， 具有?好引導骨組織向內生長能?。三、具高生物活性及誘骨性。 而生長因子則可用於骨髓基質細胞的調控，配合臨床之細胞與分子生物技術，為骨組織再生的領域的研究新範疇。 本計劃預計採用三鈣磷酸鹽【α-TCP 】和 纖維母細胞生長因子（FGF）與上皮生長因子(EGF)作為混合之材料。將分為三年完成：一、 於鈣矽類化合物結合磷酸三鈣、 磷酸三鈣結合生長因子和鈣矽類化合物結合生長因子化合物水合情形下，分析材料之物理與化學性質，包括硬化時間、酸鹼值變化、鈣離子釋出、抗壓強度等二、 於鈣矽類化合物結合磷酸三鈣、 磷酸三鈣結合生長因子和鈣矽類化合物結合生長因子化合物水合情形下、比較骨細胞對於材料之生物相容性。三、 於鈣矽類化合物結合磷酸三鈣、 磷酸三鈣結合生長因子和鈣矽類化合物結合生長因子化合物水合情形下，進行動物試驗，觀察組織學上的變化。 A bony defect was appeared at the apex of tooth after apicoectomy. It is a challenge that how doctor can repair it. The calcium silicate cement was commonly used in apicoectomy, perforation repair and apex regeneration clinically. The calcium silicate (CS) cement developed in our laboratory was found with good physical and chemical properties and biocompatibility. The motivation of present study was hoped to develop a material which can be used not only in pulp but can used in osteoconduction filed. The tricalcium phosphate （α-TCP） cement characteristic were 1. Plasticity. It can repair the complex bone fracture or defect. 2. High porosity. It is good for bone tissue growth. 3. High biocompatibility and osteoinduct ability. Growth factor (GF) was applied in bone marrow cell regulation. It is used in bone regeneration study recently. The purpose of present study is planed three years to accomplished the following goals. 1. The CS+α-TCP, α-TCP+ GF and GF+CS materials after mixed were to detect the material physical and chemical properties. It is included setting time, pH value change, calcium ion release and compression strength etc. 2. The CS+α-TCP, α-TCP+ GF and GF+CS materials after mixed were to detect the bone cell line biocompatibility and biological response. 3. The CS+α-TCP, α-TCP+ GF and GF+CS materials after mixed were to detect the histological change after material implanted into the animal tissue.
